2 edition of **Single-ion diffusion coefficients for copper (II) in aqueous CuSO r/H rSO r solutions.** found in the catalog.

Single-ion diffusion coefficients for copper (II) in aqueous CuSO r/H rSO r solutions.

James Takashi Hinatsu

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Published
**1987**
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Written in English

The Physical Object | |
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Pagination | 49 leaves |

Number of Pages | 49 |

ID Numbers | |

Open Library | OL18079146M |

where is the chemical diffusion coefficient of the Li ion, is the active mass of the working electrode, is the molar volume of the active material, is the atomic weight of the active material, is the geometric area of electrode, is the steady-state voltage change, τ is the pulse duration, E is the cell voltage, t is time, and L is the thickness of the working electrode. oC, oC, oC, and oC in vacuum to study the copper diffusion characteristics. The diffusion of copper into TaN was studied using STEM-Z contrast, where the contrast is proportional to Z2 (atomic number), and TEM. The diffusion distances (2Dt) are found to be about 5nm at oC for 30 min annealing. The diffusivity of Cu into single.

temperature dependence of the Ni diffusion coefficient as measured with QNS exhibits a deviation from the usual Arrhenius-type (Fig. 1) and follows the prediction. of mode. Fig. 1 Self-diffusion coefficients in liquid copper from quasielastic neutron scattering . LNÐ9 4 T ABLE 1 (a) Selected V alues of Dif fusion Constants (D) Diffusing Substance Solvent T ("C) D (cm 2.s Ð1) Au Cu 5 x 10 Ð13 Cu (Self-Dif fusing) (Cu) x 10 Ð12 C Fe (FCC) 10 Ð7 Methanol H 2 O 1 8 x 10 Ð5 O 2 Air 0 H 2 Air 0 1 (b) Selected V alues of D o a n d E a for Dif fusion Systems Solute Solvent D o, E a, (host structure) cm 2s kJoules/mole.

Show transcribed image text The diffusion coefficients for carbon In nickel are given at two temperatures: T(C) D(m^2/s) x 10^ x . Abstract: The value of the room-temperature copper-gold interdiffusion coefficient derived by extrapolating from high-temperature measurements is an underestimate by several orders of magnitude. Plating copper with a gold film has several disadvantages. Two specimens were analyzed by using Auger electron spectroscopy. Once the full thickness of the gold film is penetrated, copper .

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With the measured diffusion length of 12 nm, the diffusion coefficient at °C can thus be calculated to be about 8 × 10 − 18 cm 2 s − 1. In comparison, diffusion coefficients published for polycrystalline TiN barrier layers are typically in the range of 10 − 15 –10 − 14 cm 2 s − 1 for annealing temperatures of °C and would be even higher at °C [4], [31].Cited by: 8.

Determination of Diffusion Coefficient of Copper in ZnO () Single Crystals at °C. by Primavera López-Salazar 1, Gabriel Juárez-Díaz 2,*, Javier Martínez-Juárez 1, José A. Luna-López 1, Ramón Peña Sierra 3, Yuri Koudriavtsev 3, Carlos Palomino-Jiménez 2 and Angel. by: 1. This study presents a new framework for extracting single ion diffusion coefficients in ion exchange membranes from experimental ion sorption, salt permeability, and ionic conductivity data.

The framework was used to calculate cation and anion diffusion coefficients in a series of commercial ion exchange membranes contacted by aqueous NaCl by: A typical diffusion curve constmcted by TID.

Another plot for the Cu diffusion. This data is for a different diode in the same set as the one on Fig. Statistics of the diffusion parameters Do and AW estimated by the TID. TIDIF analysis diffusion curves for. Thus, Fe shows highest diffusion coefficients and lowest activation energies, to be followed by Cr.

Diffusion of Cr and Fe occurs mainly along grain boundaries, as reported in literature [16, show all steps. The diffusion coefficients for silver in copper are given at two temperatures: T (° C) D (m2/s) × 10 − × 10 − (a) Determine the values of D 0 and Qd.

(a) Diffusion coefficient and (b) concentration profiles across the diffusion layer for samples heat treated at for 1 h (x) and for h (o). 23 24 tlT ') Fig.

Arrhenius plot for diffusion coefficient values at, and 10 Acknowledgments We are grateful to Professor 1. Menzies for the provision of laboratory.

Interdiffusion coefficients in copper-titanium alloys have been determined by Matano's method in the temperature range between and K on (pure Cu)- (Cu at. pct Ti alloy) and (pure Cu)- (Cu at. pct Ti alloy) couples. Calculation Of The Interdiffusion Coefficient In The Cu–Zn Diffusion Couple Adhurim Hoxhaa and Heinrich Oettelb and Dietrich Hegerb aPolytechnic University of Tirana bTU Bergakademie Freiberg, Institut für Werkstoffwissenschaft Abstract.

A quantitative analysis of multiphase diffusion in Cu-Zn diffusion couple is presented. Diffusion is the process by which molecules, atoms, ions, point defects, or other particle types migrate from a region of higher concentration to one of lower concentration.

The diffusivity of an atom or diffusion coefficient is the rate at which a particle migrates through a particular material and is dependent on the temperature, composition gradient and pressure. Mutual diffusion coefficients (interdiffusion coefficients) and molar conductivities have been measured for copper(II) chloride in water at K and K at concentrations between molâdm-3 and molâdm The diffusion coefficients were measured using a.

The diffusion coefficients for copper in aluminum at and °C are X and x m2/s, respectively. Determine the approximate time at C that will produce the same diffusion result (in terms of concentration of Cu at some specific point in Al) as a h heat treatment at °C. Whilst earlier data on diffusion coefficients of copper chloride in aqueous solutions at 25°C and 37°C over the concentration range from to mol dm À3 have been reviewed (Ribeiro et.

The diffusion coefficient for C in Fe at this temperature is xm2/s; assume that the steel piece is semi-infinite.

• The diffusion coefficient for copper in aluminum at and oC are x and xm2/s, respectively. Determine the approximate time at oC that will produce the same diffusion result (in. I am given that the diffusion coefficients for iron in nickel are given at two temperatures (in kelvins): AtD (m^2/s)= x10^ AtD= x10^ a.) Determine the values of Do and the activation energy Qd.

b.) What is the magnitude of D at (celsius) or kelvins. I know the equation D= Doexp(-Qd/RT) But I'm not sure how to use it to solve for a because I have two unknowns. Example: At °C the diffusion coefficient and activation energy for Cu in Si are D(°C) = x m2/s Q d = kJ/mol What is the diffusion coefficient at °C.

transform data D Temp =. In each case, the self-diffusion coefficient of water and that of the electrolyte ions were computed as a function of distance from the mineral surface.

Our calculations reveal a − nm interfacial region within which the self-diffusion coefficient of water and that of the electrolyte ions decrease as the diffusing species app.

Measurements of the diffusion of 64 Cu in pure and impure α and γ iron show a large discontinuity in the Arrhenius plot of the lattice diffusion coefficient at the α‐γ transformation, contrary to the data of Anand and Agarwala [J. Appl. Phys. 37, ()]. Grain‐boundary diffusion predominates at T≤°C in the α phase and at T≤°C in the γ phase.

Chuijiro Matano applied Boltzmann's transformation to obtain a method to calculate diffusion coefficients as a function of concentration in metal alloys.

Two alloys with different concentration would be put into contact, and annealed at a given temperature for a given time t, typically several hours; the sample is then cooled to ambient temperature, and the concentration profile is virtually "frozen".

Diffusion coefficient is the proportionality factor D in Fick's law (see Diffusion) by which the mass of a substance dM diffusing in time dt through the surface dF normal to the diffusion direction is proportional to the concentration gradient grad c of this substance: dM = −D grad c dF dt.

Hence, physically, the diffusion coefficient implies that the mass of the substance diffuses through a. 2 Jq = - κcond dT dx () Jq is the heat flux, i.e. the flow of heat per unit area of the plane through which the heat traverses per second, dT dx the temperature gradient, and κcond the thermal conductivity.

It may be noted that the minus sign reflects that the heat flows from high to low temperatures; in the direction of the heat flow the temperature gradient is - dT.heat flow can be applied to the problems of impurity atom diffusion in silicon.

Diffusion equations Fick’s laws can now be applied to solve diffusion problems of interest. As was the case previously the solutions presented here assume a constant diffusivity. Infinite source diffusion into a semi-infinite body - single step diffusion.

Interdiffusion study is conducted in the Au–Cu system, which has complete solid solution in the higher temperature range and ordered phases in the lower temperature range. First experiments are conducted at higher temperatures, where atoms can diffuse randomly. Higher values of interdiffusion coefficients are found in the range of 40–50 at.% Cu.

This trend is explained with the help of.